Solutions

Solutions

Use cases × core technologies × full-chain quality — Hanye’s delivery capabilities on one page.

Use Cases

Differentiated storage for PCs, gaming, imaging, industry and brand customization.

Core Technologies

6 stages defining every link of storage performance and reliability.

01

NAND Architecture Design

Tier-1 wafers selected for endurance and efficiency

Strategic partnerships with world-leading fabs and multi-stage binning isolate high-endurance 3D TLC with excellent voltage tolerance and charge stability — the foundation of storage reliability.

232-layer 3D stackingPrime-wafer binningExtended P/E lifeLow-leakage charge traps
02

Multi-Core Controller Integration

Multi-channel concurrency meets queue scheduling

12nm/7nm multi-core ARM/RISC-V controllers with 8 channels and 32 CEs handle heavy I/O concurrently for sub-millisecond response.

8-channel concurrent busHardware crypto engineDual-core low-power coprocessorSRAM parity
03

In-House Firmware Algorithms

Smart wear leveling meets thermal policy

In-house firmware integrates 4K LDPC soft/hard decoding, dynamic SLC cache allocation and adaptive thermals — no performance cliffs on sustained writes.

4K LDPC soft-decode engineSmart SLC reclamationHMB optimizationDeterministic-latency queues
04

High-Density PCB Design

Impedance-matched multilayer boards

8–10 layer TG170 low-loss boards with 30μ" gold M.2 fingers and length-matched differential pairs suppress reflection and crosstalk.

10-layer low-loss board30μ" gold contactsLength-matched diff routingEmbedded power-ground planes
05

Advanced Thermal Design

Composite materials for thermal balance

Aerospace-grade graphene film, 6.0 W/mK phase-change pads and CNC-finned aluminum armor prevent throttling under sustained PCIe 5.0 loads.

Aerospace graphene6.0 W/mK thermal padsCNC fin armorDynamic thermal guard
06

Rigorous Validation Testing

5,000-hour continuous stress testing

Every batch passes thermal shock (-40°C to 85°C), 10,000 cold boots, reliability demos and multi-platform compatibility validation for zero-defect delivery.

5,000-hour aging10k power-loss resilienceBoard-matrix compatibilityZero-defect screening

Quality Assurance

7-stage full-chain quality control with 5,000-hour aging and multi-platform compatibility validation.

01

Incoming Inspection

100% incoming batch inspection of wafer chips and components

02

Die Screening

Rigorous dynamic bad-block and leakage screening and grading

03

Controller Validation

Multi-channel signal eye-diagram and high-speed bus protocol validation

04

Firmware Testing

Abnormal power-loss recovery and 4K LDPC decode stress testing

05

Performance Testing

Full-disk read/write consistency and sustained high-pressure I/O throughput tests

06

Reliability Testing

Thermal shock, humidity aging and drop/vibration testing

07

Final Inspection

Flawless exterior, label scanning and ESD-safe packaging

Partner with Hanye,shape the future of storage

Whether you are a global channel partner, an online store or an industry buyer, Hanye's R&D and business teams are ready with technical support and professional service.

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